| Item | 2017 | 2018 | 2019 | ||
|
Muti-layer |
Muti-layer |
8 | 10 | 10 | |
|
Inner Layer Registration |
0.075mm | 0.05mm | 0.05mm | ||
| Thickness | Rigid-Flex | 0.25~2.0mm | 0.25~2.0mm | 0.25~2.0mm | |
| FPC | 0.05~0.5mm | 0.05~0.5mm | 0.05~0.5mm | ||
|
Min. Trace Width/Space |
S/S &D/S Trace width/space |
45/45μm | 35/35μm | 30/30μm | |
|
Annular Ring |
0.075mm | 0.05mm | 0.05mm | ||
|
Impedance control |
0.1 | 0.08 | 0.08 | ||
|
Drilling |
Drilled through-hole via diameter：Mechanical Drill |
0.1mm | 0.1mm | 0.1mm | |
|
CVL |
CVL Registration |
0.1mm | 0.05mm | 0.05mm | |
|
LPI |
LPI Opening |
0.20mm | 0.20mm | 0.20mm | |
|
Solder dam |
0.1mm | 0.1mm | 0.1mm | ||
|
LPI Registration |
50μm | 30μm | 30μm | ||
|
Printing |
Printing shift |
0.200mm | 0.150mm | 0.150mm | |
| Item | 2017 | 2018 | 2019 | ||
|
SMT |
Connector pitch |
0.350mm | 0.300mm | 0.300mm | |
|
Smallest Component |
01005 |
01005 |
01005 |
||
|
Stiffener |
Stiffener Registration |
0.200mm | 0.100mm | 0.100mm | |
|
Punch |
The tolerance With Two Time Punch |
Min ±0.1 | Min ±0.1 | Min ±0.1 | |
| Finger Outline | 0.05mm | 0.05mm | 0.05mm | ||
| Finger Skewing | 0.07mm | 0.05mm | 0.05mm | ||
| Scoop Molding | Scoop Molding Tolerance | 0.075mm | 0.075mm | 0.075mm | |
|
E.T. |
4-Wire |
Y | Y | Y | |
|
Surface Treatment |
Ni-Au Plating | Ni:1.25～3.75um Range 2.5 | |||
| 3.75～10um Range 3.75 | |||||
| Au:0.025～0.125um Range 0.075 | |||||
|
Thick Au-plating |
Au:0.15～0.25um Range 0.125 | ||||
| 0.25～0.75um Range 0.2 | |||||
|
Immersion Au-Plating |
Ni:1.25～6.25um Range 2 | ||||
| Au:0.025～0.1um Range 0.075 | |||||
|
ENEPIG |
Ni:＞3um | ||||
| Pd：＞0.1um | |||||
| Au：＞0.05um | |||||
| OSP | 0.2～0.5um | ||||